Photonic Packaging Engineer
- Type
- Job
- Organization
- Quandela
- Location
- Massy, France
- Deadline
- Rolling or not stated
- Who can apply
- On-site in Massy, France
- Posted
- 29 September 2026
About this Opportunity
About QuandelaQuandela is a global leader in photonic quantum computing, developing hardware and software technologies to build scalable and energy-efficient quantum systems.With more than 140 people, we develop our own stack, from semiconductor quantum emitters and photonic integrated circuits to quantum control systems, software and algorithms.Our ambition is to build large-scale fault-tolerant quantum computers. Reaching this scale requires increasingly reliable, manufacturable and integrated photonic hardware, making our Integrated Photonics team a key part of this journey.About this posit
Eligibility
- Master's or PhD in Photonics, Physics, Engineering, Microelectronics or related fields.
- Hands-on experience in photonic, optoelectronic or semiconductor packaging.
- Practical experience in optical alignment, component assembly or related processes.
- Good understanding of packaging tolerances, process development and qualification.
- Ability to troubleshoot integration issues and develop reliable packaging solutions.
- Professional English.Important, but you can grow here
Documents you may need
- Updated CV / Resume
- Cover Letter (tailored to this role)
How to apply
- Click the "Apply — via Arbeitnow" button to go to the source page.
- Read the full description and confirm you meet the requirements.
- Prepare your CV and cover letter tailored to this role.
- Submit your application through the official portal.
- Follow up within 1–2 weeks if you do not hear back.